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vötschtechnik Heating and Drying Cabinets, HeatEvent

High-Performance Thermal Treatment in Compact Design

Simultech offers the HeatEvent series from vötschtechnik (Weiss Technik) — precision heating & drying cabinets engineered for industrial production, R&D and quality control. These units deliver reproducible results, fast recovery, and efficient operation, even under continuous 24/7 usage.

HeatEvent cabinets are designed to maximize internal usable volume while maintaining a minimal external footprint, using IE3 motors, advanced insulation, and robust door sealing.

Each unit comes standard with the S!MPAC® digital measurement & control system and the WEBSeason® interface for program creation, monitoring, and process automation (supports AMS 2750E, CQI-9).

Key Benefits & Features

1. Compact footprint, high capacity — More usable space per external size.

2. Energy efficiency — Low power draw with IE3 motors, thermal insulation, and tight door sealing.

3. Rapid recovery — Fast reheat times after door opening support short cycle operations.

4. Precision control & connectivity — Full programming, logging, network access, and remote monitoring functions.

5. Safety & process integrity — Material protection, analog/digital I/O, fault diagnostics, and optional explosion-safe “F” variants.

6. Flexible configuration & upgrade paths — Add exhaust fans, access ports, additional sensors, or higher temperature ranges.

Notes & optional enhancements:

• The “F” version supports explosive / solvent-containing processes, meeting EN 1539 safety standards.

• Exhaust air features, airflow control, or enhanced cooling may be added to speed up processes.

• Interior fittings can include shelves, rotary drums, push-through designs, or access ports.

• Control & data: Up to 99 units can be networked; optional barcode/traceability modules available.

Applications

HeatEvent cabinets are used in a variety of settings and processes including:

• Drying and curing of composite parts

• Thermal ageing, material stress testing

• Preheating, drying, or conditioning of components

• Processing tasks in automotive, aerospace, electronics, and coatings industries

• Any process requiring stable, uniform heating up to 400 °C

For flammable or solvent-based processes, choose the HeatEvent F version with enhanced safety protocols and exhaust control.

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Model Line & Technical Specifications

Below is a representative range of HeatEvent models, with key performance data based on manufacturer documentation.

HeatEvent 60/60

Chamber Volume: 0.216 m³
Inner Dimensions (W×D×H): 600 × 600 × 600 mm
External Footprint (W×D): 1,000 × 850 mm
Temperature Range: up to 220 / 300 / 350 °C
Heat Output / Recirculation Airflow: 7.2 kW / 1,200 m³/h
Temperature Uniformity / Recovery: ±2 K at 220 °C; 2.5 min recovery after 30 s door opening

HeatEvent 60/90

Chamber Volume: 0.324 m³
Inner Dimensions (W×D×H): 600 × 600 × 900 mm
External Footprint (W×D): 1,000 × 850 mm
Temperature Range: up to 220 / 300 / 350 °C
Heat Output / Recirculation Airflow: 14.4 kW / 1,200 m³/h
Temperature Uniformity: ±2.5 K at 220 °C

HeatEvent 75/125

Chamber Volume: 0.700 m³
Inner Dimensions (W×D×H): 750 × 750 × 1,250 mm
External Footprint (W×D): 1,710 × 1,190 mm
Temperature Range: up to 220 / 300 / 350 / 400 °C
Heat Output / Recirculation Airflow: 9–18 kW / 2,400 m³/h
Temperature Uniformity: ±2 K at 220 °C

HeatEvent 100/150

Chamber Volume: 1.50 m³
Inner Dimensions (W×D×H): 1,000 × 1,000 × 1,500 mm
External Footprint (W×D): 1,960 × 1,440 mm
Temperature Range: up to 400 °C
Heat Output / Recirculation Airflow: 13.2 / 26.4 / 39.6 kW / 3,400 m³/h
Temperature Uniformity: ±2 K at 220 °C

HeatEvent 125/200

Chamber Volume: 3.125 m³
Inner Dimensions (W×D×H): 1,250 × 1,250 × 2,000 mm
External Footprint (W×D): 2,210 × 1,690 mm
Temperature Range: up to 400 °C
Heat Output / Recirculation Airflow: 26.4 / 39.6 / 52.8 kW / 5,400 m³/h
Temperature Uniformity: ±2 K at 220 °C

HeatEvent 150/200

Chamber Volume: 4.50 m³
Inner Dimensions (W×D×H): 1,500 × 1,500 × 2,000 mm
External Footprint (W×D): 2,460 × 1,940 mm
Temperature Range: up to 400 °C
Heat Output / Recirculation Airflow: 39.6 / 52.8 / 66.0 kW / 6,000 m³/h
Temperature Uniformity: ±3 K at 220 °C

HeatEvent 200/200

Chamber Volume: 8.00 m³
Inner Dimensions (W×D×H): 2,000 × 2,000 × 2,000 mm
External Footprint (W×D): 2,960 × 2,440 mm
Temperature Range: up to 400 °C
Heat Output / Recirculation Airflow: 52.8 / 79.2 kW / 6,000 m³/h
Temperature Uniformity: ±3 K at 220 °C

Why Choose HeatEvent via Simultech?

By partnering with Simultech, you get:

1. Local support, installation, calibration, and maintenance

2. Custom config options and upgrades tailored to your use case

3. Integration into lab networks and data systems

4. Training, spare parts, and service management

Contact Simultech today to specify your HeatEvent model, request detailed quotes, or design a custom cabinet for your application.

Downloads

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Voetsch-Technik-Heat-Event-EN1.pdf 

Heating cabinet with flaps for loading 